Passivation role of fluorine on the anticorrosion of AlCu films after plasma etching-Reference-Cited by-同舟云学术

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Passivation role of fluorine on the anticorrosion of AlCu films after plasma etching

Published:1998-05 Issue:3 Volume:16 Page:1469-1472
ISSN:0734-2101
Container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
language:en
Short-container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films

Author:

Baek Kyu-Ha,Kim Chang-Il,Kwon Kwang-Ho,Kim Tae-Hyung,Chang Eui-Goo,Yun Sun Jin,Yoon Yong-Sun,Kim Sang-Gi,Nam Kee-Soo

Publisher

American Vacuum Society

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics

Link

http://avs.scitation.org/doi/pdf/10.1116/1.581171

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Metallization;Handbook of Semiconductor Interconnection Technology, Second Edition;2006-02-22

2. Reduction of Contact Resistivity between Al Alloy Layer and Indium Tin Oxide Layer by Fluorine Plasma Treatment;Japanese Journal of Applied Physics;2002-04-01

3. Corrosion at the Grain Boundary and a Fluorine-Related Passivation Layer on Etched Al-Cu (1%) Alloy Surfaces;ETRI Journal;1999-09-01

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