Texture and surface morphology improvement of Al by two-stage chemical vapor deposition and its integration in an Al plug-interconnect scheme for sub 0.25 μm metallization
Author:
Publisher
American Vacuum Society
Subject
Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics
Link
http://avs.scitation.org/doi/pdf/10.1116/1.581265
Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Electromigration in Al interconnects and the challenges in ultra-deep submicron technology;Acta Physica Sinica;2006
2. Scanning tunneling microscopy characterization of the surface morphology of copper films grown on mica and quartz;Thin Solid Films;2005-10
3. Atomic Layer Deposition of Aluminum Thin Films Using an Alternating Supply of Trimethylaluminum and a Hydrogen Plasma;Electrochemical and Solid-State Letters;2002
4. Study on the characteristics of alumdinum thin films prepared by atomic layer deposition;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;2002
5. Study of Bump Formation in Integrated Chemical Vapor Deposition–Physical Vapor Deposition Aluminum Filling Process;Japanese Journal of Applied Physics;2001-03-15
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