Study of Bump Formation in Integrated Chemical Vapor Deposition–Physical Vapor Deposition Aluminum Filling Process
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Published:2001-03-15
Issue:Part 1, No. 3A
Volume:40
Page:1172-1177
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ISSN:0021-4922
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Container-title:Japanese Journal of Applied Physics
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language:en
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Short-container-title:Jpn. J. Appl. Phys.
Author:
Lee Joo Wan,Kim Byoung Youp,Han Sang Yeop,Lee Won-Jun,Kim Jun Ki,Park Jin-Won,Roh Jae Sung,Kim Yeong-Cheol
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering