Subject
Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics
Cited by
23 articles.
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1. Research of ultra high aspect ratio silicon etching in the advanced process;2022 China Semiconductor Technology International Conference (CSTIC);2022-06-20
2. Dry Etching;Reference Module in Materials Science and Materials Engineering;2016
3. Through-Silicon Vias Using Bosch DRIE Process Technology;Ultra-thin Chip Technology and Applications;2010-11-12
4. High aspect ratio silicon etch: A review;Journal of Applied Physics;2010-09
5. Dry Etching;Comprehensive Microsystems;2008