Digital chemical vapor deposition and etching technologies for semiconductor processing-Reference-Cited by-同舟云学术

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Digital chemical vapor deposition and etching technologies for semiconductor processing

Published:1990-05 Issue:3 Volume:8 Page:1844-1850
ISSN:0734-2101
Container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
language:en
Short-container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films

Author:

Horiike Y.,Tanaka T.,Nakano M.,Iseda S.,Sakaue H.,Nagata A.,Shindo H.,Miyazaki S.,Hirose M.

Publisher

American Vacuum Society

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics

Link

http://avs.scitation.org/doi/pdf/10.1116/1.576814

Cited by 66 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Etch-stop mechanisms in plasma-enhanced atomic layer etching of silicon nitride: A molecular dynamics study;Journal of Vacuum Science & Technology A;2024-08-05

2. Fluid models calculation of Ar/CF₄ radiofrequency capacitively coupled plasmas;Physica Scripta;2024-07-15

3. Molecular dynamics simulations of silicon nitride atomic layer etching with Ar, Kr, and Xe ion irradiations;Japanese Journal of Applied Physics;2024-07-01

4. Surface chemical reactions of etch stop prevention in plasma-enhanced atomic layer etching of silicon nitride;Surface and Coatings Technology;2024-02

5. Raman scattering monitoring of thin film materials for atomic layer etching/deposition in the nano-semiconductor process integration;Chemical Physics Reviews;2023-12-01

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