Influence of Microcracks on Strength of Diamond Wire Sawn Silicon Substrates-Reference-Cited by-同舟云学术

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Influence of Microcracks on Strength of Diamond Wire Sawn Silicon Substrates

Published:2021 Issue: Volume: Page:365-383
ISSN:2195-4356
Container-title:Lecture Notes in Mechanical Engineering
language:
Short-container-title:

Author:

Wallburg Florian^ORCID,Meyer Kevin^ORCID,Budnitzki Michael,Kuna Meinhard,Kaule Felix^ORCID,Schoenfelder Stephan^ORCID

Publisher

Springer Singapore

Link

http://link.springer.com/content/pdf/10.1007/978-981-15-9893-7_26

Reference24 articles.

1. Moeller HJ, Funke C, Rinio M, Scholz S (2005) Multicrystalline silicon for solar cells. Thin Solid Films 487(1–2):179–187

2. Watanabe N, Kondo Y, Ide D, Matsuki T, Takato H, Sakata I (2010) Characterization of polycrystalline silicon wafers for solar cells sliced with novel fixed-abrasive wire. Progr Photovolt Res Appl 18:485–490

3. ITRPV (2017) International technology roadmap for photovoltaics eighth edition: 2016 results

4. ITRPV (2019) International technology roadmap for photovoltaics tenth edition: 2018 results

5. Wu H (2016) Wire sawing technology: a state-of-the-art review. Precis Eng 43:1–9

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A critical review on the fracture of ultra-thin photovoltaics silicon wafers;Solar Energy Materials and Solar Cells;2024-08

2. Coupled SPH-FEM modeling of Berkovich indenter scratching of single-crystal silicon;Materials Science in Semiconductor Processing;2024-04

3. A material removal coefficient for diamond wire sawing of silicon;Wear;2022-09

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