Coupled SPH-FEM modeling of Berkovich indenter scratching of single-crystal silicon

Author:

Li Long,Ge PeiqiORCID

Funder

Key Technology Research and Development Program of Shandong Province

National Natural Science Foundation of China

Publisher

Elsevier BV

Reference66 articles.

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2. Formation mechanism of wire bow and its influence on diamond wire saw process and wire cutting capability;Qiu;Int. J. Mech. Sci.,2020

3. Wire sawing technology: a state-of-the-art review;Wu;Precis. Eng.,2016

4. Research on suppressing brittle fracture and implementing ductile mode cutting for improving surface quality at silicon wafers manufacturing;Kovalchenko;J. Phys.: Conf. Ser.,2021

5. Material removal mechanism and crack propagation in single scratch and double scratch tests of single-crystal silicon carbide by abrasives on wire saw;Wang;Ceram. Int.,2019

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