Author:
Lee Jing Rou,Abdul Aziz Mohd Sharizal,Rosli Muhammad Faiz Ridhwan,Rusdi Mohd Syakirin,Kamaruddin Roslan,Ishak M. H. H.,Mohd Salleh Mohd Arif Anuar
Publisher
Springer Nature Singapore
Reference24 articles.
1. T. Gregorich, A. Gu, Accelerate the Development of Advanced IC Packages Using 3D X-ray Microscopes to Measure and Characterize Buried Features (2019)
2. J.H. Lau, Recent advances and new trends in flip chip technology. J. Electron. Packag. Trans. ASME 138(3), 16–22 (2016). https://doi.org/10.1115/1.4034037
3. J.H. Lau, Chapter 2 Flip chip technology versus FOWLP, in Fan-Out Wafer-Level Packaging (Springer, Singapore, 2018), pp. 21–68
4. R. Asghar, F. Rehman, A. Aman, K. Iqbal, A.A. Nawaz, Defect minimization and process improvement in SMT lead-free solder paste printing: a comparative study. Solder. Surf. Mt. Technol. 32(1), 1–9 (2020). https://doi.org/10.1108/SSMT-05-2019-0019
5. W.N.C. Weng, Chapter 5 Evolution of Pb-free solders, in Recent Progress in Soldering Materials, ed. by A.A. Mohamad (IntechOpen, London, United Kingdom, 2017), pp. 91–108
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