Impact of a Tubular Dielectric Medium on Peak Noise and Crosstalk Delay in a Coaxial TSV
Author:
Publisher
Springer Nature Singapore
Link
https://link.springer.com/content/pdf/10.1007/978-981-99-0055-8_16
Reference22 articles.
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2. Liu B, Li C, Li C, Zhang S (2021) Effect of temperature and single event transient on crosstalk in coupled single-walled carbon nanotube (SWCNT) bundle interconnects. Int J Circuit Theory Appl 49(10):3408–3420
3. Jin J, Zhao WS, Wang DW, Chen HS, Li EP, Yin WY () Investigation of carbon nanotube-based through-silicon vias for PDN applications. IEEE Trans Electromagn Compat 60(3):738–746 92018
4. Nabil A, Bernardo JA, Ma Y, Abouelatta M, Shaker A, Bouchet LF, Ragai H, Gontrand C (2020) Electrical modeling of tapered TSV including MOS-field effect and substrate parasitics: analysis and application. Microelectron J 100:104797
5. Hu QH, Zhao WS, Fu K, Wang DW, Wang G (2021) Electrical modeling of carbon nanotube-based shielded through-silicon vias for three-dimensional integrated circuits. Int J Numer Model Electron Netw Devices Fields 34(3):e2842
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