Author:
Seki Kenichi,Nishimura Hidekazu
Publisher
Springer Science and Business Media LLC
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering,Architecture,Civil and Structural Engineering
Reference19 articles.
1. Baldwin CY, Clark KB (2000) Design rules, vol 1: The power of modularity. The MIT press, Massachusetts
2. Chen C, Hodes M, Manzione L (2001) Sizing of heat spreaders above dielectric layers. J Electron Packag 123(3):173+. doi: 10.1115/1.1377271
3. Choi J, Kim Y, Sivasubramaniam A, Srebric J, Wang Q, Lee J (2007) Modeling and managing thermal profiles of rack-mounted servers with thermostat. In: IEEE 13th international symposium, pp 205–215. doi:/ 10.1109/HPCA.2007.346198
4. Cong J, Wei J, Zhang Y (2004) A thermal-driven floor planning algorithm for 3d ics. In: Computer aided design. ICCAD-2004. IEEE/ACM international conference, pp 306–313. http://ieeexplore.ieee.org/xpls/absall.jsp/arnumber=1382591
5. Eppinger S, Cho S (2001) Product development process modeling using advanced simulation. In: Proceedings of the ASME DETC (DETC2001/DTM-21691)
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