Sizing of Heat Spreaders Above Dielectric Layers-Reference-Cited by-同舟云学术

Sizing of Heat Spreaders Above Dielectric Layers

Published:2001-02-12 Issue:3 Volume:123 Page:173-181
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Chen Calvin¹,Hodes Marc¹,Manzione Lou¹

Affiliation:

1. Bell Laboratories, Lucent Technologies, 700 Mountain Ave., Murray Hill, NJ 07974

Abstract

A means to properly size rectangular heat spreaders between a dielectric layer connected to thermal ground and a power device is developed by modeling the problem as a thermal resistance network. Generalized formulas and nondimensional charts to optimize heat spreader thickness and footprint are presented. The power device and heat spreader are assumed to be (concentric) rectangular solids of arbitrary length, width and thickness. The nondimensional results are validated by finite element analysis (FEA) and examples demonstrate the utility of the methodology to thermal design engineers.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/123/3/173/5883086/173_1.pdf

Reference9 articles.

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2. Kennedy, D. P. , 1960, “Spreading Resistance in Cylindrical Semiconductor Devices,” J. Appl. Phys., 31, No. 8, pp. 1490–1497.

3. Lee, S., Song, S., Au, V., Moran, K. P., 1995, “Constriction/Spreading Resistance Model for Electronics Packaging,” Proc. ASME/JSME Thermal Engineering Joint Conference, Vol. 4, L. S. Fletcher, and T. Aihara, eds., pp. 199–206.

4. Song, S., Lee, S., and Au, V., 1994, “Closed-Form Equation for Thermal Constriction/Spreading Resistances with Variable Resistance Boundary Condition,” Proc. 1994 International Electronics Packaging Conference (IEPS), IEPS, Inc., pp. 111–121.

5. Yovanovich, M. M., Muzchka, Y. S., and Culham, J. R., 1999, “Spreading Resistance of Isoflux Rectangles and Strips on Compound Flux Channels,” J. Thermophys. Heat Transfer, 13, No. 4, pp. 495–500.

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