Review of planarization and reliability aspects of future interconnect materials-Reference-Cited by-同舟云学术

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Review of planarization and reliability aspects of future interconnect materials

Published:1996-10 Issue:10 Volume:25 Page:1617-1622
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:JEM

Author:

Sethuraman Anantha R.,Wang Jiun-Fang,Cook Lee M.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/BF02655585.pdf

Reference15 articles.

1. J. Li, T.E. Siedel and J.W. Mayer,MRS Bulletin August, 15 (1994).

2. D.C. Edelstem,Proc. of VMIC 1995, June (1995), p. 301.

3. S.Q. Wang,MRS Bulletin August, 30 (1994).

4. Y. Arita,Semiconductor World December, 158 (1993).

5. K. Weide and W. Hasse,Proc. of ULSI-X Conf., (Pittsburgh, PA: Mater. Res. Soc., 1994), p. 397.

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