Study of Pyrazole as Copper Corrosion Inhibitor in Alkaline Post Chemical Mechanical Polishing Cleaning Solution
Author:
Publisher
The Electrochemical Society
Subject
Electronic, Optical and Magnetic Materials
Reference41 articles.
1. Review of planarization and reliability aspects of future interconnect materials
2. Interconnect fabrication processes and the development of low-cost wiring for CMOS products
3. Pattern Geometry Effects in the Chemical‐Mechanical Polishing of Inlaid Copper Structures
4. Pattern-Dependent Copper Microcorrosion from CMP
5. Effect of pH on CMP of Copper and Tantalum
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