Diffusion Mobilities in fcc Cu-Au and fcc Cu-Pt Alloys
Author:
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Metals and Alloys,Condensed Matter Physics
Link
http://link.springer.com/content/pdf/10.1007/s11669-009-9469-2.pdf
Reference47 articles.
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2. H. Ono, T. Nakano and T. Ohta (1994) Diffusion Barrier Effects of Transition Metals for Cu/M/Si Multilayers (M=Cr, Ti, Nb, Mo, Ta, W), Appl. Phys. Lett 64: 1511-1513
3. A. N. Aleshin, V. K. Egorov, B. S. Bokstein and P. V. Kurkin (1993) Study of Diffusion in Thin Au-Cu Films, Thin Solid Films 223: 51-55.
4. J. Wang, H. S. Liu, L. B. Liu and Z. P. Jin (2008) Assessment of Diffusion Mobilities in FCC Cu–Ni Alloys, Calphad, 32(1): 94-100
5. G. Ghosh (2001) Dissolution and Interfacial Reactions of Thin-film Ti/Ni/Ag Metallizations in Solder Joints, Acta Mater, 49: 2609-2624.
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