Thermal optimization of high power LED arrays with a fin cooling system-Reference-Cited by-同舟云学术

Thermal optimization of high power LED arrays with a fin cooling system

Published:2011-03-27 Issue:11-13 Volume:42 Page:679-684
ISSN:0306-8919
Container-title:Optical and Quantum Electronics
language:en
Short-container-title:Opt Quant Electron

Author:

Jang Sun Ho,Shin Moo Whan

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11082-011-9454-y.pdf

Reference7 articles.

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2. Kim L., Shin M.W.: Thermal resistance measurement of LED package with multichips. IEEE Trans. Compon. Packag. Technol. 30(4), 632–636 (2007)

3. Mentor Graphics Ltd., FloThermTM 8.1 Instruction Manual (2010)

4. Miner A., Ghoshal U.: Cooing of high-power-density micro devices using liquid metal coolants. Appl. Phys. Letters 85, 506–508 (2004)

5. Moreno, I., Tzonchev, R.I.: Effects on illumination uniformity due to dilution on array of LEDs. In: Proceeding of SPIE, Bellingham, WA. 5529, 268–275 (2004)

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