Author:
Sayed Hussain,Zurfi Ahmed,Zhang Jing
Publisher
Springer Science and Business Media LLC
Subject
Surfaces, Coatings and Films,Hardware and Architecture,Signal Processing
Reference20 articles.
1. Ozpineci, B., & Tolbert, L. M. (2004). Comparison of wide-bandgap semiconductors for power electronics applications. Washington: Department of Energy.
2. Noppakunkajorn, J., Han, D., & Sarlioglu, B. (2015). Analysis of high-speed PCB with SiC devices by investigating turn-off overvoltage and interconnection inductance influence. IEEE Transactions on Transportation Electrification,
1(2), 118–125.
3. Han, D., & Sarlioglu, B. (2016). Comprehensive study of the performance of SiC MOSFET-based automotive DC–DC converter under the influence of parasitic inductance. IEEE Transactions on Industry Applications,
52(6), 5100–5111.
4. Lemmon, A., Banerjee, S., Matocha, K., & Gant, L. (2016). Analysis of packaging impedance on performance of SiC MOSFETs. In International exhibition and conference for power electronics, intelligent motion, renewable energy and energy management, PCIM Europe (pp. 10–12).
5. Walder, S., & Yuan, X. (2015). Effect of load parasitics on the losses and ringing in high switching speed SiC MOSFET based power converters. In IEEE energy conversion congress and exposition (pp. 6161–6168).
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献