CMOS substrate coupling modeling and analysis flow for submicron SoC design
Author:
Publisher
Springer Science and Business Media LLC
Subject
Surfaces, Coatings and Films,Hardware and Architecture,Signal Processing
Link
http://link.springer.com/content/pdf/10.1007/s10470-016-0883-1.pdf
Reference22 articles.
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3. Charbon, E., et al. (1999). Modeling digital substrate noise injection in mixed signal IC’s. IEEE Transactions on Computer Aided Design, 18(3), 301–310.
4. Gharpurey, R., & Meyer, G. (1996). Modeling and analysis of substrate coupling in integrated circuits. IEEE Journal of Solid state circuits, 31(3), 125–128.
5. Stanisic, B. R., et al. (1994). Addressing substrate coupling in mixed-mode IC’s: Simulation and power distribution synthesis. IEEE Journal of Solid state circuits, 29(3), 226–238.
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