Mitigation of Threshold Voltage Shift Due to Negative Bias Temperature Instability by Exploiting Solgel-Derived TiO2 Incorporation

Author:

Karim Nissar Mohammad,Soin Norhayati,Fearday Christopher

Publisher

Springer Science and Business Media LLC

Subject

Engineering (miscellaneous)

Reference13 articles.

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3. Yang JB, Chen TP, Gong Y, Tan SS, Ng CM, Chan L (2010) Improvement of negative bias temperature instability by stress proximity technique. IEEE Trans Electron Devices 57:238–243

4. C.-H. Chen, T.L. Lee, T.H. Hou, C.L. Chen, C.C. Chen, J.W. Hsu, K.L. Cheng, Y.H. Chiu, H.J. Tao, Y. Jin (2004) Stress memorization technique (SMT) by selectively strained-nitride capping for sub-65 nm high-performance strained-Si device application, In: IEEE 2004 symposium on VLSI technology. Digest of technical papers, pp 56–57

5. Yang HS, Malik R, Narasimha S, Li Y, Divakaruni R, Agnello P, Allen S, Antreasyan A, Arnold JC, Bandy K (2004) Dual stress liner for high performance sub-45 nm gate length SOI CMOS manufacturing, In: IEEE international electron devices meeting. IEDM Technical Digest, pp 1075–1077

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