Spreading and interlayer formation at the copper-copper oxide/polycrystalline alumina interface-Reference-Cited by-同舟云学术

Spreading and interlayer formation at the copper-copper oxide/polycrystalline alumina interface

Published:1994-11 Issue:11 Volume:25 Page:2497-2506
ISSN:1073-5623
Container-title:Metallurgical and Materials Transactions A
language:en
Short-container-title:MMTA

Author:

Baldwin M. D.,Chidambaram P. R.,Edwards G. R.

Publisher

Springer Science and Business Media LLC

Subject

Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

http://link.springer.com/content/pdf/10.1007/BF02648869.pdf

Reference29 articles.

1. A.W. Adamson:Physical Chemistry of Surfaces, 4th ed., John Wiley & Sons, New York, NY, 1982.

2. P.R. Chidambaram, G.R. Edwards, and D.L. Olson:Composite Interfaces, 1993, vol. 1 (2), pp. 127–40.

3. P.R. Chidambaram, A. Meier, G.R. Edwards, and D.L. Olson:International Trends in Welding Science and Technology, S.A.David and J.M. Vitek, eds., ASM INTERNATIONAL, Metals Park, OH, 1993, pp. 1107–11.

4. P.R. Sharps, A.P. Tomsia, and J.A. Pask:Acta Metall., 1981, vol. 29, pp. 855–65.

5. A. Meier: Ph.D. Thesis Proposal, Colorado School of Mines, Golden, CO, 1993.

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