Affiliation:
1. Institute of Materials Processing, Warsaw University of Technology, Warsaw, Poland
Abstract
The joint copper-alumina obtained at a solidification condition of Cu/Cu2O eutectic was studied. Experiments involved many different techniques, such as scanning electron microscopy (SEM), X-ray diffractometry, X-ray microanalysis, and transmission electron microscopy (TEM). It was observed that a thin inhomogeneous interfacial layer is present between Cu and Al2O3 ceramics and it consists of two sublayers: the first is nanocrystalline complex oxide CuAlO2. This layer changes progressively into a crystalline CuAl2O4 sublayer. A model of liquid phase bonding between copper and alumina is proposed.
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献