Intermetallic growth in gold ball bonds aged at 175°C: comparison between two 4N wires of different chemistry-Reference-Cited by-同舟云学术

Intermetallic growth in gold ball bonds aged at 175°C: comparison between two 4N wires of different chemistry

Published:2009-06 Issue:2 Volume:42 Page:92-105
ISSN:0017-1557
Container-title:Gold Bulletin
language:en
Short-container-title:Gold Bull

Author:

Breach C. D.,Wulff F. W.

Publisher

Springer Science and Business Media LLC

Subject

Inorganic Chemistry,General Materials Science

Link

https://link.springer.com/content/pdf/10.1007/BF03214919.pdf

Reference44 articles.

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2. C.D. Breach, F. Wulff.Microelectronics Reliability 44 (2004) 973

3. N. Noolu, N. Murdheshwar, K. Ely, J. Lippold, W. Baeslack.Journal of Electronic Materials 33 (2004); 340

4. G.Y. Jang, J.G. Duh, H. Takahashi, D. Su.Journal of Electronic Materials 35 (2006); 323

5. P.D. Ngo, Chapter 4 in Failure Analysis of Integrated Circuits: Tools & Techniques, Edited by L.C. Wagner. Springer -Verlag Series in Engineering & Computer Science (1999)

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