1. T.J.S. Anand, C.K. Yau, and L.B. Huat, Oxidation Study on As-Bonded Intermetallic of Copper Wire–Aluminum Bond Pad Metallization for Electronic Microchip, Mater. Chem. Phys., 2012, 136(2–3), p 638–647.
2. J. Qi, N.C. Hung, M. Li et al., Effects of Process Parameters on Bondability in Ultrasonic Ball Bonding, Scr. Mater., 2006, 54(2), p 293–297.
3. Y.C. Guo, G.X. Yang, J.W. Kong et al., Development and Application of Gold Bonding Wires, Precious Metals, 2009, 30(3), p 68–78.
4. G.X. Yang, J.W. Kong, Y.C. Guo et al., Study on Gold Bonding Wires Applied on Semiconductor Package, Precious Metals, 2010, 31(1), p 13–16.
5. L. Chang, B. Sun, P.L. Xu et al., Analysis on Main Factors of Gold Wire Bonding Failure, Equip. Electron. Prod. Manuf., 2021, 050(002), p 23–28.