Author:
Li Jun,Huang Junyang,Hua Chengxu,Wang Jianjie,Zhu Yongwei,Zuo Dunwen
Funder
Natural Science Foundation of Jiangsu Province
Research Fund of Key Laboratory for Precision & Non-traditional Machining of Ministry of Education, Dalian University of Technology
Fundamental Research Funds for the Central Universities
Publisher
Springer Science and Business Media LLC
Subject
Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Software,Control and Systems Engineering
Reference25 articles.
1. Zhao TC, Deng QF, Yuan JL, Lyu BH, Lin YB (2016) An experimental investigation of flat polishing with dielectrophoretic (DEP) effect of slurry. Int J Adv Manuf Technol 84(5–8):1737–1746
2. Li J, Wang WZ, Wang HM, Song LL, Hu ZG, Zhu YW, Zuo DW (2015) Influence of acid slurries on surface quality of LBO crystal in fixed abrasive CMP. Int J Adv Manuf Technol 78(1–4):493–501
3. Zhou C, Shan L, Hight JR, Ng SH, Danyluk S (2002) Fluid pressure and its effects on chemical mechanical polishing. Wear 253(3–4):430–437
4. Wang TQ, Zhan DW, He YY, Lu XC (2013) Effect of slurry injection position on material removal in chemical mechanical planarization. Int J Adv Manuf Technol 67(9–12):2903–2908
5. Yoon Y, Baig M, Lee D (2008) Experimental and numerical analysis of slurry flow in chemical mechanical polishing. J Korean Phys Soc 53:2129–2137
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