Chemically grafted polyurethane/graphene ternary slurry for advanced chemical–mechanical polishing of single-crystalline SiC wafers-Reference-Cited by-同舟云学术

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Chemically grafted polyurethane/graphene ternary slurry for advanced chemical–mechanical polishing of single-crystalline SiC wafers

Published:2022-04-22 Issue:11-12 Volume:120 Page:7157-7169
ISSN:0268-3768
Container-title:The International Journal of Advanced Manufacturing Technology
language:en
Short-container-title:Int J Adv Manuf Technol

Author:

Liu Hsien-Kuang,Chen Chao-Chang A.,Hsieh Ping-Chun

Funder

Ministry of Science and Technology, Taiwan

Publisher

Springer Science and Business Media LLC

Subject

Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Software,Control and Systems Engineering

Link

https://link.springer.com/content/pdf/10.1007/s00170-022-09241-w.pdf

Reference12 articles.

1. Chen CCA, Shu LS, Lee SR (2003) Mechano-chemical polishing of silicon wafers. J Mater Process Technol 140:373–378

2. Liu HK, Chen CCA, Chen WC (2020) Effects of compound diamond slurry with graphene for lapping of sapphire wafers. Int J Adv Manuf Technol 106:4755–4768

3. Chen G, Ni Z, Xu L, Li Q, Zhao Y (2015) Performance of colloidal silica and ceria based slurries on CMP of Si-face 6H-SiC substrates. Appl Surf Sci 359:664–668

4. Yin T, Doi T, Kurokawa S, Ohnishi O, Yamazaki T, Wang Z, Tan Z (2012) Processing properties of strong oxidizing slurry and effect of processing atmosphere in SiC-CMP. Int Conf Planarization/CMP Technol (ICPT) 1–6

5. Lagudu URK, Babu SV (2014) Effect of transition metal compounds on amorphous SiC removal rates. ECS J Solid State Sci Technol 3:219–225

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1. Mechanism and experimental study of photoelectro-Fenton composite magnetorheological polishing;Ceramics International;2024-07

2. MD simulation of chemically enhanced polishing of 6H-SiC in aqueous H2O2;Journal of Manufacturing Processes;2023-12

3. Chemical–Mechanical Polishing of 4H Silicon Carbide Wafers;Advanced Materials Interfaces;2023-04-04

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