Comparison of bending fracture strength of silicon after ablation with nanosecond and picosecond lasers

Author:

Noh Jiwhan,Kim Jae-Hyun,Sohn Hyonkee,Lee Jae-Hoon

Publisher

Springer Science and Business Media LLC

Subject

Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Software,Control and Systems Engineering

Reference25 articles.

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4. Lee YH, Choi KJ (2010) Analysis of silicon via hole drilling for wafer level chip stacking by UV laser. Int J Precis Eng Manuf 11(4):501–507

5. Waits CM, Morgan B, Kastantin M, Ghodssi R (2005) Microfabrication of 3D silicon MEMS structures using gray-scale lithography and deep reactive ion etching. Sensors Actuators A Phys 119(1):245–253

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