Digital twin of stone sawing processes

Author:

Polini WilmaORCID,Corrado Andrea

Publisher

Springer Science and Business Media LLC

Subject

Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Software,Control and Systems Engineering

Reference39 articles.

1. Jerro HD, Pang SS, Yang C, Mirshams RA (1999) Kinematics analysis of the chipping process using the circular diamond saw blade. J Manuf Sci Eng 121:257–264. https://doi.org/10.1115/1.2831214

2. Brach K, Pai DM, Ratterman E, Shaw MC (1988) Grinding forces and energy. J Eng Ind 110:25–31. https://doi.org/10.1115/1.3187838

3. Asche J, Tonshoff HK, Friemunth T (1999) Cuutting principles, wear and applications of diamond tools in the stone and civil engineering industry. In: Proc Diam Tools Conf, pp 151–157, Turin, Italy

4. Pai DM, Ratterman E, Shaw MC (1989) Grinding swarf. Wear. 131:329–339. https://doi.org/10.1016/0043-1648(89)90173-7

5. Tönshoff HK, Warnecke G (1982) Research on stone sawing. In: Daniel P (ed) Adv. Ultrahard Mater. Appl. Technol. De Beers Industrial Diamond Division Publisher, Hornbeam, pp 36–39

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