Kinematics Analysis of the Chipping Process Using the Circular Diamond Saw Blade

Author:

Jerro H. D.1,Pang S. S.1,Yang C.2,Mirshams R. A.3

Affiliation:

1. Department of Mechanical Engineering, Louisiana State University, Baton Rouge, Louisiana

2. Department of Mechanical Engineering, Wichita State University, Wichita, Kansas

3. Department of Mechanical Engineering, Southern University, Baton Rouge, Louisiana

Abstract

One of the primary goals in the design of a diamond blade cutting system is to reduce the cutting force. By understanding the fundamentals of the kinematics of the sawing operation, these forces can be lowered and even optimized with respect to the machining parameters. In this work the material chipping geometries have been mathematically defined and derived through kinematic analysis. These geometries are bounded by four curves and depend on the parameters: depth of cut h, blade diameter D, transverse rate of the workpiece νT, peripheral speed of the saw blade νP, and grit spacing λ. From these chipping geometries, chip area and thickness relations have been obtained. A relation for the mean chip thickness to grit spacing ratio (tc/λ) has also been obtained as a function of the nondimensional machining parameter ratios, h/D and νT/νP. The effects of these parameters on tc were also investigated. It was found that increasing ω and D, reduces the chip thickness. Contrarily, increasing νT, λ, and h, increases the magnitude of the chip thickness. A review of older chipping models was performed, comparing well with the developed model. The results show an excellent agreement between the new model and the older ones. However, at moderately small to large h/D values the new model yields a more exact result. Thus, for h/D values greater than 0.08, it is recommended that the kinematic model be used to compute tc and other pertinent sawing parameters (i.e., grit force and grinding ratio) which are a function of tc.

Publisher

ASME International

Subject

Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Control and Systems Engineering

Reference23 articles.

1. Backer W. A. R. , MarshallE. R., ShawM. C., 1952, “The Size Effect in Metal Cutting,” Transactions of the ASME, Vol. 74, Jan., pp. 61–71.

2. Bailey, M. W., and Bullen, G. J., 1979, “Sawing in the Stone and Civil Engineering Industries,” Industrial Diamond Review, Feb., pp. 56–60.

3. Bailey, M. W., and Collins, N. D., 1977, “Investigations Into Diamond Sawing Using Titanized Grits,” Stone Industries, Stone Industrial Publications Ltd., London, Nov./Dec., pp. 18–21.

4. Beyer, W. H., ed., 1981, CRC Standard Mathematical Tables, 26th ed., CRC Press, Inc., Boca Raton, FL, pp. 414–417.

5. Brecker, J. N., and Shaw, M. C., 1974 “Measurement of the Effective Number of Cutting Points in the Surface of a Grinding Wheel,” Proceedings of the International Conference on Production Engineering, Tokyo, Japan, pp. 740–745.

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