Bayesian spatial defect pattern recognition in semiconductor fabrication using support vector clustering

Author:

Yuan Tao,Bae Suk Joo,Park Jong In

Publisher

Springer Science and Business Media LLC

Subject

Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Software,Control and Systems Engineering

Cited by 29 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Implementation of Silicon Wafer Defect Classification Web application using Deep Learning;2024 International Conference on Advancements in Power, Communication and Intelligent Systems (APCI);2024-06-21

2. Wafer map failure pattern classification using geometric transformation-invariant convolutional neural network;Scientific Reports;2023-05-19

3. Enhanced Deep Convolutional Neural Network for Identifying and Classification of Silicon Wafer Faults in IC Fabrication Industries;2023 International Conference on Wireless Communications Signal Processing and Networking (WiSPNET);2023-03-29

4. Advances in machine learning and deep learning applications towards wafer map defect recognition and classification: a review;Journal of Intelligent Manufacturing;2022-08-23

5. Recognition of unknown wafer defect via optimal bin embedding technique;The International Journal of Advanced Manufacturing Technology;2022-06-22

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