Author:
Meng Nie,Jianguo Cao,Yueming Liu,Jianyong Li
Publisher
Springer Science and Business Media LLC
Subject
Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Software,Control and Systems Engineering
Reference21 articles.
1. Lee ES, Lee SG, Choi WK et al (2013) Study on the effect of various machining speeds on the wafer polishing process. Int J Adv Manuf Technol 27(10):3155–3160
2. Uneda M, Maeda Y, Shibuya K et al (2014) Influence of pad surface asperity on removal rate in chemical mechanical polishing of large-diameter silicon wafer applied to substrate of GaN-based LEDs. Sens Mater 26(6):435–445
3. Xu YC, Lu J, Xu XP et al (2018) Study on high efficient sapphire wafer processing by coupling SG-mechanical polishing and GLA-CMP. Int J Mach Tools Manuf 130-131(2018):12–19
4. Meyer S, Wahl S, Timmel S, Köpge R, Jang BY (2016) The impact of wafering on organic and inorganic surface contaminations. Appl Surf Sci 378(2016):384–387
5. Tricard M, Dumas PR, Golini D, et al. (2003). SOI wafer polishing with magnetorheological finishing (MRF). In: IEEE Int Conf on SOI, Newport Beach. 127–129
Cited by
11 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献