Investigations on Process Parameters of Cluster Magnetorheological Polishing in a planet motion model

Abstract

Abstract A planetary-type cluster magnetorheological polishing device with a rotating magnetic field was proposed to solve the problems of abrasive accumulation and low polishing efficiency caused by the untimely restoration of the conventional magnetic chain. Considering the microstructural deformation and squeeze-strengthening effect of magnetorheological polishing fluid, a material removal rate model was established based on the principle of fluid dynamic pressure and verified by experiments. The relationships between material removal rate or roughness and processing parameters were confirmed by multiple linear regression analyses, respectively. And the processing parameters optimization was made by linear weighting method under the premise of establishing the evaluation system. The results show that the eccentricity and angular velocity ratio are proportional and inversely proportional to MRR, respectively. When the polishing fluid is squeezed, the material removal rate can be significantly increased from 7nm/min to 21nm/min, but the roughness will be reversed at a gap of less than 0.9mm. After the optimization of processing parameters, the workpiece roughness after rough and fine polishing was reduced from 1.079µm and 1.083µm to 0.346µm and 0.184µm, with a reduction of 67.9% and 83.01%.