Research Progress in Pb-Free Soldering
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Publisher
Springer Berlin Heidelberg
Link
http://link.springer.com/content/pdf/10.1007/978-3-662-48823-2_1
Reference109 articles.
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3. Tu KN. Solder joint technology: materials, properties, and reliability. New York: Springer; 2007. p. 386.
4. Abtew M, Selvaduray G. Lead-free solders in microelectronics. Mater Sci Eng R. 2000;27:95–141.
5. Zeng K, Tu KN. Six cases of reliability study of Pb-free solder joints in electronic packaging technology. Mater Sci Eng R. 2002;38:55–105.
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