Encapsulated micro mechanical sensors

Author:

Esashi Masayoshi

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference25 articles.

1. Esashi, M.: (1990) Sensor Packaging; In: Reichl. H. “ed.” (Micro System Technologies 90), pp. 495–502, Springer-Verlag, Berlin

2. Esashi, M.;Matsumoto, Y.;Shoji, S.: (1990) Absolute pressure sensors by air-tight electrical feedthrough structure, Sensors and Actuators, A21-A23: 1048–1052

3. Matsumoto, Y.; Shoji, S.; Esashi, M.: (1990) A miniature integrated capacitive pressure sensor, Tech. Digest of the 9th Sensor Sympt., 43–46

4. Henmi, H.; Yoshimi, K.; Shoji, S.; Esashi, M.: (1993) Vacuum packaging for micro sensors by glass-silicon anodic bonding, Transducer'93, 584–587

5. Sensors;M. Esashi,1994

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