Visual Inspection of Soldering Joints by Neural Network with Multi-angle View and Principal Component Analysis

Author:

Matsushima Michiya,Kawai Naohiro,Fujie Hiroyuki,Yasuda Kiyokazu,Fujimoto Kozo

Publisher

Springer London

Reference18 articles.

1. Robertson, G. I., 1987, Automatic Optical Inspection of Printed Circuit Boards During Assembly, Proceedings of SME Visio'87, 59-67.

2. Ryu, Y. K., Cho, H. S., 1997, New Optical Measuring System for Solder Joint Inspection, Optics and Lasers in Engineering, 26/6:487-514.

3. Japan Welding Society Microsoldering Technology Education Committee, 2002,Standard Microsoldering Technology, Nikkan Kogyo Shimbun, Ltd.

4. Matsuyama, Y., Honda, T., Yamamura, H., Sasazawa, H., Nomoto, M., Ninomiya, T., 1996, Automated Solder Joint Inspection System Using Optical 3-D Image Detection," WACV '96, 116.

5. Asakura, Y., Takahashi, Y., 2003, Feature Extraction for Fillet Profile of Pb-free Solder and Its Application to Inspection, Trans. JWRI, 32/1:55-58.

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