Author:
Wu Hao,Lv Quanquan,Yang Jiankang,Yan Xiaodong,Xu Xiangrong
Abstract
Purpose
This paper aims to propose a deep learning model that can be used to expand the number of samples. In the process of manufacturing and assembling electronic components on the printed circuit board in the surface mount technology production line, it is relatively easy to collect non-defective samples, but it is difficult to collect defective samples within a certain period of time. Therefore, the number of non-defective components is much greater than the number of defective components. In the process of training the defect detection method of electronic components based on deep learning, a large number of defective and non-defective samples need to be input at the same time.
Design/methodology/approach
To obtain enough electronic components samples required for training, a method based on the generative adversarial network (GAN) to generate training samples is proposed, and then the generated samples and real samples are used to train the convolutional neural networks (CNN) together to obtain the best detection results.
Findings
The experimental results show that the defect recognition method using GAN and CNN can not only expand the sample images of the electronic components required for the training model but also accurately classify the defect types.
Originality/value
To solve the problem of unbalanced sample types in component inspection, a GAN-based method is proposed to generate different types of training component samples and then the generated samples and real samples are used to train the CNN together to obtain the best detection results.
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science
Reference22 articles.
1. Application of neural networks in optical inspection and classification of solder joints in surface mount technology;IEEE Transactions on Industrial Informatics,2006
2. A new IC solder joint inspection method for an automatic optical inspection system based on an improved visual background extraction algorithm;IEEE Transactions on Components, Packaging and Manufacturing Technology,2015
3. SMT solder joint inspection via a novel cascaded convolutional neural network;IEEE Transactions on Components, Packaging and Manufacturing Technology,2018
4. Deep-learning-based defective bean inspection with GAN-structured automated labeled data augmentation in coffee industry;Applied Sciences,2019
5. Deep generative image models using a Laplacian pyramid of adversarial networks;Advances in Proceedings of the 28th International Conference on Neural Information Processing Systems,2015
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. An AHP-Based Defect Detection Algorithm Study for E-paper Pockmarks Detection;2024 International Conference on Artificial Intelligence and Digital Technology (ICAIDT);2024-06-07
2. Fully Convolutional Networks for Automatically Generating Image Masks to Train Mask R-CNN;2021 IEEE International Conference on Robotics and Biomimetics (ROBIO);2021-12-27