Automated solder joint inspection system using optical 3-D image detection-Reference-Cited by-同舟云学术

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Automated solder joint inspection system using optical 3-D image detection

Published: Issue: Volume: Page:
ISSN:
Container-title:Proceedings Third IEEE Workshop on Applications of Computer Vision. WACV'96
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Author:

Matsuyama Y.,Honda T.,Yamamura H.,Sasazawa H.,Nomoto M.,Ninomiya T.,Schick A.,Listl L.,Kollensperger P.,Spriegel D.,Mengel P.,Schneider R.

Publisher

IEEE Comput. Soc. Press

Link

http://xplorestaging.ieee.org/ielx3/4231/12271/00572014.pdf?arnumber=572014

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. PCB Soldering Defect Inspection Using Multitask Learning under Low Data Regimes;Advanced Intelligent Systems;2023-09-21

2. Defect Detection Based on Image Recognition;Proceedings of the International Conference on Cognitive and Intelligent Computing;2022

3. Visual Inspection of Soldering Joints by Neural Network with Multi-angle View and Principal Component Analysis;Service Robotics and Mechatronics;2010

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