Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Signal Processing
Reference29 articles.
1. Adly, F., Alhussein, O., Yoo, P.D., Al-Hammadi, Y., Taha, K., Muhaidat, S., Jeong, Y.S., Lee, U., Ismail, M.: Simplified subspaced regression network for identification of defect patterns in semiconductor wafer maps. IEEE Trans. Industr. Inf. 11(6), 1267–1276 (2015)
2. Adly, F., Yoo, P.D., Muhaidat, S., Al-Hammadi, Y., Lee, U., Ismail, M.: Randomized general regression network for identification of defect patterns in semiconductor wafer maps. IEEE Trans. Semicond. Manuf. 28(2), 145–152 (2015)
3. Arthur, D., Vassilvitskii, S.: K-means++ the advantages of careful seeding. In: Proceedings of the eighteenth annual ACM-SIAM symposium on discrete algorithms, pp. 1027–1035 (2007)
4. Chen, S., Liu, M., Hou, X., Zhu, Z., Huang, Z., Wang, T.: Wafer map defect pattern detection method based on improved attention mechanism. Expert Syst. Appl. 230, 120544 (2023)
5. Chien, C.F., Hsu, S.C., Chen, Y.J.: A system for online detection and classification of wafer bin map defect patterns for manufacturing intelligence. Int. J. Prod. Res. 51(8), 2324–2338 (2013)
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