Author:
Guo Zhongnan,Li Shan,Mikula Adolf,Yuan Wenxia
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Metals and Alloys,Physical and Theoretical Chemistry,Condensed Matter Physics
Reference16 articles.
1. Hindler M., Lead-Free Solder Alloys: Thermodynamic Properties and Surface Tension [Dissertation], University of Vienna, Vienna, 2011: 3.
2. Jin S., and McCormack M., Materials update: lead-free solders, Mater. Lett., 1994, 20(3–4): 91.
3. Chidambaram V., Hattel J., and Hald J., Design of lead-free candidate alloys for high-temperature soldering based on the Au-Sn system, Mater., Design, 2010, 31(10): 4638.
4. Kloeser J., Zakel E., Bechtold F., and Reichl H., Reliability investigations of fluxless flip-chip interconnections on gree tape ceramic substrates, IEEE CPMT, 1996, 19A(1): 24.
5. Sheen M.T., Ho Y.H, Wang C.L, Hsieh K.C., and Cheng W.H., The joint strength and microstructure of fluxless Au/Sn solders in InP-based laser diode packages, J. Electron. Mater., 2005, 34(10): 1318.
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