Modeling of some physicochemical properties in the liquid Au–Bi–Sn alloys relevant for Pb-free soldering

Abstract

In this paper, some geometrical models such as Kohler, Muggianu, Toop, and Hillert have been used to estimate the molar volume of Au–Bi–Sn ternary systems based on the data of sub-binary systems over a wide temperature range (673–973[Formula: see text]K). The density of Au–Bi–Sn alloys was calculated from the calculated molar volume and using theoretical equation along three cross-sections [Formula: see text]/[Formula: see text]/2, 1/1 and 2/1. In addition, the viscosity of Au–Bi–Sn alloys was calculated by using Seetharaman–Sichen equation over a wide temperature range (673–1273[Formula: see text]K). The density of these alloys show linear dependence on temperature for all investigated compositions, while the molar volumes increase with increasing temperature and Sn compositions. The results show, as a function of temperature, that the increase in concentration of tin influences the viscosity of the Au–Bi–Sn alloys. The calculated values of density of Au–Bi–Sn alloys are compared with the experimental values reported in the literature, and a good agreement was observed.