Improved electromigration reliability of surface acoustic wave devices using Ti/Al-Mo/Ti/Al-Mo electrodes
Author:
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Metals and Alloys,Physical and Theoretical Chemistry,Condensed Matter Physics
Link
http://link.springer.com/content/pdf/10.1007/s12598-009-0107-2.pdf
Reference13 articles.
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2. Sung C.C. and Huang C.Y., Properties of pseudomode surface acoustic waves on ST-cut quartz substrates and the effects of the thicknesses of metallic films, Acoust. Phys., 2006, 52(3): 338.
3. Kimura N., Nakano M., Nakazawa M., et al., The power durability of 900 MHz band double-mode-type surface acoustic wave filters and improvement in power durability of Al-Cu thin film electrodes by Cu atom segregation, Jpn. J. Appl. Phys., 1997, 36: 3101.
4. Kimura N., Nakano M., and Sato K., Power durability of Al-W alloy electrodes used in RF-band surface acoustic wave filters, Jpn. J. Appl. Phys., 1998, 37(3A): 1017.
5. Sakurai A., Yoshino Y., and Ieki H., Epitaxially grown aluminum film on 36 degrees-related Y-cut lithium tantalate for high-power surface acoustic wave devices, Jpn. J. Appl. Phys., 1994, 33: 3015.
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2. Enhanced power durability of surface acoustic wave filter with Al/Ti/Cu/Ti electrodes;Journal of Alloys and Compounds;2018-04
3. Significant enhancement in electromigration resistance and texture of aluminum films using an ultrathin titanium underlayer;Acta Materialia;2013-07
4. Study on Property of Ti-Based Nonevoparobal Getter;Advanced Materials Research;2010-10
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