Enhanced mechanical properties in Al/diamond composites by Si addition
Author:
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Metals and Alloys,Physical and Theoretical Chemistry,Condensed Matter Physics
Link
http://link.springer.com/content/pdf/10.1007/s12598-015-0515-4.pdf
Reference15 articles.
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3. Yoshida K, Morigami H. Thermal properties of diamond/copper composite material. Microelectron Reliab. 2004;44(2):303.
4. Tan ZQ, Li ZQ, Xiong DB, Fan GL, Ji G, Zhang D. A predictive model for interfacial thermal conductance in surface metallized diamond aluminum matrix composites. Mater Des. 2014;55:257.
5. Guo H, Bai ZH, Zhang XM, Yin FZ, Jia CC, Han YY. Evolution of thermo-physical properties of diamond/Cu composite materials under thermal shock load. Rare Met. 2014;33(2):185.
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