Affiliation:
1. Nanjing University of Science and Technology
Abstract
Diamond/aluminum matrix composite with high thermal conductivity is of great significance to solve the heat dissipation problem of large-scale integrated circuits and high-power components. This paper reviews the current research status of diamond/aluminum matrix composites, and analyzes the effects of the preparation and processing of the composites, the interface bonding between diamond and aluminum matrix, the reinforced diamond and matrix alloy elements on the properties of the composites.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
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