Author:
Chu Ke,Jia Cheng-chang,Liang Xue-bing,Chen Hui
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Metals and Alloys,Geochemistry and Petrology,Mechanical Engineering,Mechanics of Materials
Reference17 articles.
1. Q. Zhang and D. Sun, Recent achievements in research for electronic packaging substrate materials, J. Mater. Sci. Technol., 8(2000), p.66.
2. M. Robins, Thermal management materials and design, Electron. Packag. Prod., 40(2000), p.50.
3. S.B. Ren, X.B. He, X.H. Qu, et al., Effect of Mg and Si in the aluminum on the thermo-mechanical properties of pressureless infiltrated SiCP/Al composites, Compos. Sci. Technol., 67(2007), p.2103.
4. L. Zhang, X.H. Qu, B.H. Duan, et al., Microstructure and thermo-mechanical properties of pressureless infiltrated SiCp/Cu composites, Compos. Sci. Technol., 68(2008), p.2731.
5. Y. Yamamoto, T. Imai, K. Tanabe, et al., The measurement of thermal properties of diamond, Diamond Relat. Mater., 6(1997), p.1057.
Cited by
48 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献