Slotted capacitive microphone with sputtered aluminum diaphragm and photoresist sacrificial layer

Author:

Ganji Bahram Azizollah,Majlis Burhanuddin Yeop

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference15 articles.

1. Bergqvist J, Gobet J (1994) Capacitive microphone with a surface micromachined backplate using electroplating technology. J Microelectromech Syst 3(2):69–75

2. Chowdhury S, Jullien GA, Ahmadi MA, Miller WC (2000) MEMS acousto-magnetic components for use in a hearing instrument. Presented at SPIE’s symposium on design, test integration, and packaging of MEMS/MOEMS, Paris

3. Hsu PC, Mastrangelo CH, Wise KD (1988) A high density polysilicon diaphragmcondenser microphone. In conference record IEEE 11th international workshop on microelectro mechanical systems (MEMS), pp 580–585

4. Jing C, Liu L, Li Z, Tan Z, Xu Y, Ma J (2003) On the single-chip condenser miniature microphone using DRIE and back side etching techniques. Sens Actuators A 103:42–47

5. Kabir AE, Bashir R, Bernstein J, De Santis J, Mathews R, O’Boyle JO, Bracken C (1999) Very high sensitivity acoustic transducers with thin P+ membrane and gold back plate sensors and actuators-A, 78:138–142

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