Author:
Feiertag Gregor,Winter Matthias,Leidl Anton
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference8 articles.
1. Dehé A (2007) Silicon microphone development and application. Sens Actuators A 133:283–287
2. Feiertag G, Krüger H, Bauer C (2007) Surface acoustic wave component packaging. In: Proceedings of 16th European microelectronics and packaging conference (EMPC), 2007:134–138
3. Füldner M, Dehé A (2007) Challenges of high SNR silicon micro machined microphones. In: Proceedings of 19th international congress on acoustics, Madrid, Sep 2007
4. Knowles (2009) www.knowles.com
5. Müllenborn M, Rombach P, Klein U, Rasmussen K, Kuhmann JF, Heschel M, Amskov Gravad M, Janting J, Branebjerg J, Hoogerswerf AC, Bouwstra S (2001) Chip-size-packaged silicon microphones. Sens Actuators A 92:23–29
Cited by
7 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献