Chip-size-packaged silicon microphones-Reference-Cited by-同舟云学术

Chip-size-packaged silicon microphones

Published:2001-08 Issue:1-3 Volume:92 Page:23-29
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Müllenborn M.,Rombach P.,Klein U.,Rasmussen K.,Kuhmann J.F.,Heschel M.,Gravad M.Amskov,Janting J.,Branebjerg J.,Hoogerwerf A.C.,Bouwstra S.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference12 articles.

1. A Review of Silicon Microphones;Scheeper;Sens. Actuators A,1994

2. Micromachined Double Backplate Differential Capacitive Microphone;Bay;J. Micromech. Microeng.,1999

3. A. Torkkeli, H. Sipola, H. Seppä, J. Saarilahti, O. Rusanen, J. Hietanen, Capacitive Microphone with Low-stress Polysilicon Membrane and High-stress Polysilicon Backplate, Eurosensors XIII, The Hague, The Netherlands, 12–15 September 1999.

4. P.-C. Hsu, C.H. Mastrangelo, K.D. Wise, A High Sensitivity Polysilicon Diaphragm Condenser Microphone, MEMS‘98, pp. 580–585.

5. P. Rombach, M. Müllenborn, U. Klein, R. Frehoff, A Low-Voltage Silicon Condenser Microphone for Hearing Instrument Applications, Forum Acusticum, Berlin, Germany, 14–19 March 1999.

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