Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference15 articles.
1. Aoki M, Hozawa K, Takeda K (2010) Presented at IEEE International 3D Systems Integration Conference 3DIC in Munich
2. Baum M, Hofmann L, Wiemer M, Schulz S, Gessner T (2013) Presented at International Semiconductor Conference Dresden-Grenoble ISCDG in Dresden
3. Gondcharton P, Imbert B, Benaissa L, Verdier M (2014) Voiding phenomena in copper-copper bonded structures: role of creep. ECS Trans 64(5):357–367
4. Lhostis S, Farcy A, Deloffre E, Lorut F et al. (2016) Presented at Electronic Components and Technology Conference ECTC in Las Vegas
5. Lifshitz IM, Slyozov VV (1961) The kinetics of precipitation from supersaturated solid solutions. J Phys Chem Solids 19(1–2):35–50
Cited by
7 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献