Author:
Ganji Bahram Azizollah, ,Majlis Burhanuddin Yeop
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference17 articles.
1. Bergqvist J, Gobet J (1994) Capacitive microphone with a surface micromachined backplate using electroplating technology. J Microelectromech Syst 3(2):69–75
2. Chowdhury S, Jullien GA, Ahmadi MA, Miller WC (2000) MEMS acousto-magnetic components for use in a hearing instrument. Presented at SPIE’s Symposium on design, test integration, and packaging of MEMS/MOEMS, Paris
3. Ganji BA, Majlis BY (2009) Design and fabrication of a new MEMS capacitive microphone using a perforated aluminum diaphragm. Sens Actuators A Phys 149:29–37
4. Hsu PC, Mastrangelo CH, Wise KD (1988) A high density polysilicon diaphragmcondenser microphone. In: Proceedings of the 11th IEEE Conference Record International Workshop on MicroElectro Mechanical Systems (MEMS), pp 580–585
5. Jing C, Liu L, Li Z, Tan Z, Xu Y, Ma J (2003) On the single-chip condenser miniature microphone using DRIE and back side etching techniques. Sens Actuators A Phys 103:42–47
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