Revisiting micro hot-embossing with moulds in non-conventional materials

Author:

Khan Malek Chantal,Coudevylle Jean-René,Jeannot Jean-Claude,Duffait Roland

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference23 articles.

1. Becker H, Heim U (1999) Silicon material as tool material for polymer hot embossing. IEEE Proceedings of the 12th international conference on micro electro mechanical systems MEMS’99, Orlando, pp 228–231

2. Brown L, Koerner T, Oleschuk R (2004) Fabrication of epoxy stamps for hot embossing microfluidic devices and sub-micron structures. Proceedings of the μTAS 2004, 8th international conference on miniaturized systems for chemistry and life sciences, Malmö, Sweden, 26–30 September, pp 52–54

3. Carvalho BL, Schilling EA, Schmid N, Kellog GJ (2003) Soft embossing of microfluidic devices. Proceedings of the 7th international conference on miniaturized chemical and biochemical analysis systems, Squaw Valley, pp 959–962

4. Chou SY, Krauss PR, Renstrom PJ (1996) Imprint lithography with 25-nanometer resolution. Science 272(5258):85–87

5. Edwards TL, Mohanty SK, Edwards RK, Thomas C, Frazier AB (2000) Rapid tooling using SU-8 for injection molding microfluidic components. SPIE micro fluidic devices and systems conference, Santa Clara, September, pp 82–89

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