Low-cost silicon wafer dicing using a craft cutter-Reference-Cited by-同舟云学术

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Low-cost silicon wafer dicing using a craft cutter

Published:2014-05-20 Issue:7 Volume:21 Page:1411-1414
ISSN:0946-7076
Container-title:Microsystem Technologies
language:en
Short-container-title:Microsyst Technol

Author:

Fan Yiqiang,Arevalo Arpys,Li Huawei,Foulds Ian G.

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s00542-014-2198-4.pdf

Reference10 articles.

1. Efrat U (1993) Optimizing the wafer dicing process. In: Electronic Manufacturing Technology Symposium, 1993, Fifteenth IEEE/CHMT International, 4–6 Oct 1993, pp 245–253. doi: 10.1109/iemt.1993.398195

2. Jianhua L, Hyeon H, Eun-Chul A, Qiang C, Pyoungwan K, Teakhoon L, Myeongkee C, Taegyeong C (2007) Laser dicing and subsequent die strength enhancement technologies for ultra-thin wafer. In: Electronic Components and Technology Conference, 2007. ECTC ‘07. 57th Proceedings. May 29 2007–June 1 2007, pp 761–766. doi: 10.1109/ectc.2007.373883

3. Kumagai M, Uchiyama N, Ohmura E, Sugiura R, Atsumi K, Fukumitsu K (2007) Advanced dicing technology for semiconductor wafer—stealth dicing. Semicond Manuf IEEE Trans 20(3):259–265. doi: 10.1109/tsm.2007.901849

4. Lizotte T (2003) Laser dicing of chip scale and silicon wafer scale packages. In: Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. IEEE/CPMT/SEMI 28th International, 16–18 July 2003, pp 1–5. doi: 10.1109/iemt.2003.1225869

5. Panzner M, Kasper J, Wust H, Klotzbach U, Beyer E (2002) In: Processing of silicon by Nd:YAG lasers with harmonics generation 2002, pp 496–504

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