Laser dicing of chip scale and silicon wafer scale packages-Reference-Cited by-同舟云学术

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Laser dicing of chip scale and silicon wafer scale packages

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Container-title:IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003.
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Author:

Lizotte T.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/8681/27505/01225869.pdf?arnumber=1225869

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Laser Assisted Cleaving for Waveguide Facets on Silicon;2022 Intermountain Engineering, Technology and Computing (IETC);2022-05

2. Characterizing students' arguments and explanations of a discipline‐based computational modeling activity;Computer Applications in Engineering Education;2020-05-11

3. An overview of through-silicon-via technology and manufacturing challenges;Microelectronic Engineering;2015-03

4. Low-cost silicon wafer dicing using a craft cutter;Microsystem Technologies;2014-05-20

5. Thin silicon wafer dicing with a dual-focused laser beam;Journal of Micromechanics and Microengineering;2007-11-06

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